When trace contamination matters
Particles, organic residues, elemental impurities and outgassing can affect process stability, equipment performance, yield and long-term reliability. Cleaning must therefore be controlled across the component lifecycle, not treated only as a final step.
FinnSonic helps semiconductor manufacturers, equipment suppliers and specialist cleaning providers build repeatable water-based cleaning processes for maintenance, manufacturing and final cleanroom preparation.
High-purity cleaning solutions
FinnSonic develops customer-specific ultrasonic cleaning solutions for semiconductor manufacturing equipment, precision components and ultra-high-vacuum applications. Systems can range from flexible manual units to automated multistage lines with washing, rinsing, ultra-pure final rinsing, drying, handling and process documentation.
The process is defined around the parts, materials, contamination, cleanliness target, capacity, cleanroom environment and verification requirements.
The system layout is divided between the cleanroom and the technical room.
From maintenance cleaning to final cleaning
Maintenance cleaning
Remove deposited films, particles, hydrocarbons and operational contamination from chamber components, gas-delivery hardware, vacuum parts and precision assemblies before reinstallation.
Intermediary cleaning
Remove machining oils, polishing compounds and particles between manufacturing stages to reduce contamination transfer and prepare parts for subsequent operations.
Precision and final cleaning
Prepare critical components for cleanroom assembly, packaging or installation by controlling particles, organic residues, elemental contamination and outgassing-related surface residues.
Semiconductor applications
FinnSonic cleaning processes can be developed for:
- EUV and DUV lithography equipment
- Inspection and metrology systems
- Deposition and coating equipment
- Electron-beam and laser systems
- UHV and XHV equipment
- Gas-delivery systems, manifolds and pipe assemblies
- Vacuum chambers and vacuum hardware
- Precision-machined components
- Ceramic, quartz and glass components
- Sealing and flow-control components
- Wafer-handling equipment
- Maintenance, refurbishment and remanufacturing operations
Manual and Automated Solutions from Grade 4 to Grade 1
FinnSonic offers scalable ultrasonic cleaning solutions ranging from standalone cleaning units to fully automated multistage systems.
Manual solutions provide a flexible and cost-effective platform for maintenance cleaning, low-volume production, specialized cleaning applications and process development.
Automated multistage systems integrate washing, rinsing, ultra-pure final rinsing, drying, process control and documentation into a repeatable production process designed for demanding semiconductor applications.
Key technologies include:
- Water-based ultrasonic cleaning
- FinnSonic Genius technology with automatic frequency and power regulation
- Multiple ultrasonic frequencies including 27, 37, 80 and 132 kHz
- High-purity DI water treatment systems
- HEPA-assisted and vacuum drying
- Automated basket transfer systems
- Complete encapsulation and controlled airflow
- Advanced process control systems
- Batch reporting and full process traceability
- Integration with customer factory and Industry 4.0 systems
Whether the requirement is maintenance cleaning, intermediary manufacturing cleaning, Grade 4 precision cleaning or Grade 1 final cleaning for advanced semiconductor applications, FinnSonic solutions are designed to deliver validated, reproducible and traceable cleaning performance throughout the entire manufacturing lifecycle.
Cleanroom-compatible cleaning solutions
Achieving high-purity cleanliness requires more than an effective cleaning process alone. The entire cleaning environment must be designed to minimize contamination and prevent recontamination.
FinnSonic solutions can be configured for operation inside cleanrooms or integrated with adjacent technical spaces and pass-through interfaces. Available features include:
- ISO 7, ISO 6 and ISO 5 compatible implementations
- AMC-compatible system designs
- Low-outgassing materials and construction
- HEPA-filtered drying systems
- HEPA laminar airflow solutions
- Cleanroom-compatible automation and material handling
- Pass-through loading and unloading systems
- Ultra-pure DI water generation and recirculation
- TOC reduction and ultrafiltration systems
- Electropolished tanks and high-purity piping
- Vacuum and hot-air drying technologies
The combination of cleanroom-compatible design, high-purity materials, controlled drying and ultra-pure water treatment helps ensure that the achieved cleanliness level is maintained throughout the process.
Support for wafer production
Ultrasonic cleaning can remove sawing residues, polishing compounds, particles and process contamination from wafers, carriers, fixtures, tooling and production equipment. Cleaning and de-coupling after wafer slicing are relevant where reliable processing and throughput are critical.
Built on process control
FinnSonic combines ultrasonic cleaning technology, high-purity rinsing and drying, cleanroom-compatible engineering, automation and lifecycle support into one process-focused solution.
Discuss your cleaning process
Whether you need maintenance cleaning, intermediary manufacturing cleaning or high-purity final cleaning, FinnSonic specialists can help define a practical process for your parts, cleanliness targets and production environment.